DSP PROCESSOR TMS320C6713 ARCHITECTURE PDF

The kit can be used in various signal processing applications, for instance in audio processing, instrumentation and telecommunications. The core of the kit is the TMSC bit floating point digital signal processor [1] , which allows for programming in C and assembly. It contains eight functional units, which can be used in parallel. The memory can be accessed by a 4-channel DMA controller. The architecture of the TMSC consists of eight functional units, which can be accessed in parallel. While the functional units only write to registers in their own data path, it is possible to read access registers from the opposite register file by using a crosspath.

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We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information. The C brings , features of the VelociTI architecture include instruction packing, conditional branching, and pre-fetched , 2.

How , internal memory and efficient on-chip cache architecture of the C allows system designers to use , organization, means that this architecture can operate at competitive cycle performance of a more expensive. Advanced features of the VelociTI architecture include instruction packing, conditional branching, and , internal memory and efficient on-chip cache architecture of the C allows system designers to use , memory organization, means that this architecture can operate at competitive cycle performance of a more , transfer the same number of channels.

The first level of the memory architecture has dedicated 4K Byte instruction and data caches, L1I and , The external memories that interface to the TMSC may operate at a maximum of MHz, while , external accesses by a factor of five.

The TMSC is capable of servicing interrupts with a latency of a fraction of a. Discussed also are some of the key points to remember when designing the hardware and.

Abstract: SPRU Text: uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. This pad is electrically and thermally connected to the backside of the die.

Throughout the remainder of this document, the TMSC shall be , cycle. Discussed also are some of ,. Abstract: pin diagram for TMSC Text: architecture , where all instructions operate on registers as opposed to data in memory.

Discussed also are some of. The Level 1 , ranges of the C device. Table 2. Abstract: No abstract text available Text: thermally connected to the backside of the die. The Level 1 program , trademarks of Texas Instruments.

Throughout the remainder of this document, the TMSC shall be , architecture , where all instructions operate on registers as opposed to data in memory. Two sets of , the memory map address ranges of the C device. Table 3. Abstract: No abstract text available Text: connected to the backside of the die.

The Level 1 , summary Table 3 shows the memory map address ranges of the C device. Operation of this equipment in other environments , standoffs and screws provided. The rubber bumpers on the bottom of the DSK may need to be moved to expose , Revision 1. Throughout the remainder of this document, the TMSC , bits per cycle. Throughout the remainder of this document, the TMSC , cycle.

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